Monday, November 29

Samsung Electronics develops next-generation 2.5D packaging solution ‘H-Cube’

Samsung Electronics announced on the 11th that it has developed the industry’s best packaging technology that can mount more than six high-bandwidth memories (HBM). This is the result of collaboration with Amkor Technology, a semiconductor packaging and testing company (OSAT). The ‘H-Cube’ (Hybrid-Substrate Cube) developed by Samsung Electronics is a central processing unit (CPU) and graphic processing unit (G) on a silicon interposer.

Leave a Reply

Your email address will not be published. Required fields are marked *